Equipment performance
This machine adopts the Diode Pump laser. It has the characters of higher integrative degree, better quality of laser beam, lower running cost and little maintenance during long time. Imported key ***re parts, simple structure for whole machine, fast scribing speed and higher precision, it can work continuously over 24 hours.
Applicable fields
Scribing for the mono-crystalline sillicon, poly-crystalline sillicon, amorphous-crystalline sillicon, solar cell, wafer in solar industry.
Cutting for the mono-crystalline sillicon and poly-crystalline sillicon in electronic industry.
Product Features:
Semiconductor Pump Laser Scribing machine belong to the Middle &Top level products of YAG Lasers. It has the features such as high quality, competitive price, Low in process cost, Better marking effect, Reliability etc.
Entire Modular Design:
Each modular has the corresponding independent movement ***ce. Mutually connect simply and directly. Maximum reduces the electromagnetism interference and heat interference and guarantees the system long time operation stability.
Professional Laser Cavity design:
The specialized laser resonant cavity design, guarantee the maximum optical efficiency and best laser pattern. At the same time, it may reduce the temperature dependence.
Installation:
It may install the assembly production line, excellent marking with high performance.
2. Technology Parameter:
Type specification Diode pump laser 50W
Laser wavelength 1064nm
Scriber precision ≤�0μm
Max scriber thickness 1.2mm
Scriber line width �0μm
Laser repetition frequency 200Hz~50kHz
Max scriber speed 120mm/s
Laser max power r �0W
Work platform size 350×350mm (or as request)
Power supply 220V/ 50Hz /2kVA
Cooling system Water cooling system
Work platform The adsorption of vacuum pump on two dimension programmed moving platform. |
Home
